发明授权
- 专利标题： Silicon based microchannel cooling and electrical package
- 专利标题（中）： 硅基微通道冷却和电气封装
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申请号： US12062055申请日： 2008-04-03
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公开(公告)号： US08110415B2公开(公告)日： 2012-02-07
- 发明人: John Ulrich Knickerbocker , John H. Magerlein
- 申请人： John Ulrich Knickerbocker , John H. Magerlein
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理商 Michael J. Buchenhorner; Vazken Alexanian
- 主分类号： H01L21/66
- IPC分类号： H01L21/66
摘要：
A chip package includes: a substrate; a plurality of conductive connections in contact with the silicon carrier; a silicon carrier in a prefabricated shape disposed above the substrate, the silicon carrier including: a plurality of through silicon vias for providing interconnections through the silicon carrier to the chip; liquid microchannels for cooling; a liquid coolant flowing through the microchannels; and an interconnect to one or more chips or chip stacks.