发明授权
- 专利标题: Curable resin composition
- 专利标题(中): 可固化树脂组合物
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申请号: US12494540申请日: 2009-06-30
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公开(公告)号: US08110645B2公开(公告)日: 2012-02-07
- 发明人: Shigeki Mori , Yukihiro Nomura , Kazuhiro Iyo , Shinichi Sato
- 申请人: Shigeki Mori , Yukihiro Nomura , Kazuhiro Iyo , Shinichi Sato
- 申请人地址: JP
- 专利权人: Konishi Co., Ltd.
- 当前专利权人: Konishi Co., Ltd.
- 当前专利权人地址: JP
- 代理机构: Kilpatrick Townsend & Stockton LLP
- 优先权: JPP2003-277042 20030718
- 主分类号: C08G77/60
- IPC分类号: C08G77/60
摘要:
Disclosed is a moisture-curing type curable resin composition containing: a curable resin intramolecularly having a silicon-containing functional group; and a Lewis acid or a complex of the Lewis acid as a curing catalyst, the Lewis acid being selected from the group consisting of metal halides and boron halides, which is rapidly cured at room temperature. The silicon-containing functional group is represented by general formula: —SiX1X2X3 or —SiR1X1 X2 (wherein, X1, X2 and X3 respectively represent a hydrolytic group and may be the same as or different from each other, and R1 represents a substituted or unsubstituted organic group having 1 to 20 carbons). If the silicon-containing functional group is —SiR1X1 X2, the curable resin further contains intramolecularly a polar component that is one of urethane, thiourethane, urea, thiourea, substituted urea, substituted thiourea, amide, and sulfide bonds, and hydroxyl, secondary amino and tertiary amino groups. Two-part type adhesive is constitutable with separating the curable resin from the curing catalyst.
公开/授权文献
- US20090264602A1 Curable Resin Composition and Cold Setting Adhesive 公开/授权日:2009-10-22