发明授权
US08110907B2 Semiconductor device including first substrate having plurality of wires and a plurality of first electrodes and a second substrate including a semiconductor chip being mounted thereon, and second electrodes connected with first electrodes of first substrate
有权
包括具有多条导线的第一基板和多个第一电极的半导体装置和其上安装有半导体芯片的第二基板，以及与第一基板的第一电极连接的第二电极
- 专利标题： Semiconductor device including first substrate having plurality of wires and a plurality of first electrodes and a second substrate including a semiconductor chip being mounted thereon, and second electrodes connected with first electrodes of first substrate
- 专利标题（中）： 包括具有多条导线的第一基板和多个第一电极的半导体装置和其上安装有半导体芯片的第二基板，以及与第一基板的第一电极连接的第二电极
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申请号： US12318798申请日： 2009-01-08
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公开(公告)号： US08110907B2公开(公告)日： 2012-02-07
- 发明人: Masahiro Yamaguchi , Emi Sawayama , Hiroshi Oyama , Shigeharu Tsunoda , Yasuo Amano , Naoki Matsushima
- 申请人： Masahiro Yamaguchi , Emi Sawayama , Hiroshi Oyama , Shigeharu Tsunoda , Yasuo Amano , Naoki Matsushima
- 申请人地址： JP Tokyo
- 专利权人： Elpida Memory, Inc.
- 当前专利权人： Elpida Memory, Inc.
- 当前专利权人地址： JP Tokyo
- 代理机构： McGinn Intellectual Property Law Group, PLLC
- 优先权： JP2008-033008 20080214
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A semiconductor device includes a semiconductor chip, a first substrate, and a second substrate. The first substrate includes a plurality of wires and a plurality of first electrodes, each first electrode being connected with each wire. The second substrate includes the semiconductor chip that is mounted thereon, and a plurality of second electrodes with, each second electrode being connected with the each first electrode of the first substrate. The widths of the wires of the first substrate are different depending on the lengths of the wires. By changing the widths of the wires depending on their lengths, it is possible to reduce variation in stiffness of the electrodes and vicinities of electrodes, whereby variation in ultrasonic bonding strength can be reduced.
公开/授权文献
- US20090206492A1 Semiconductor device 公开/授权日：2009-08-20