Invention Grant
- Patent Title: Method of manufacturing photosensitive epoxy structure using photolithography process and method of manufacturing inkjet printhead using the method of manufacturing photosensitive epoxy structure
- Patent Title (中): 使用光刻工艺制造感光性环氧树脂结构的方法和使用制造感光性环氧树脂结构的方法制造喷墨打印头的方法
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Application No.: US11968809Application Date: 2008-01-03
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Publication No.: US08114578B2Publication Date: 2012-02-14
- Inventor: Moon-chul Lee , Yong-seop Yoon , Min-soo Kim , Yong-won Jeong , Dong-sik Shim
- Applicant: Moon-chul Lee , Yong-seop Yoon , Min-soo Kim , Yong-won Jeong , Dong-sik Shim
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Stanzione & Kim, LLP
- Priority: KR10-2007-0081461 20070813
- Main IPC: B41J2/16
- IPC: B41J2/16

Abstract:
Provided are a method of manufacturing a photosensitive epoxy structure using a photolithograph process, and a method of manufacturing an inkjet printhead using the method of manufacturing a photosensitive epoxy structure. The method of manufacturing the photosensitive epoxy structure includes forming an epoxy material layer formed of photosensitive epoxy; forming a first exposure pattern in the epoxy material layer by performing a first exposure operation; forming a second exposure pattern in the non-exposed portions of the epoxy material layer by performing a second exposure operation; and developing the epoxy material layer, wherein the amount of first UV energy used in the first exposure operation is different from the amount of second UV energy used in the second exposure operation.
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