Invention Grant
- Patent Title: Method of manufacturing material to be etched
- Patent Title (中): 制造待蚀刻材料的方法
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Application No.: US12065755Application Date: 2006-08-25
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Publication No.: US08114685B2Publication Date: 2012-02-14
- Inventor: Tatsuya Yoshizawa , Kenichi Nagayama , Takuya Hatakeyama
- Applicant: Tatsuya Yoshizawa , Kenichi Nagayama , Takuya Hatakeyama
- Applicant Address: JP Tokyo
- Assignee: Pioneer Corporation
- Current Assignee: Pioneer Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2005-256946 20050905
- International Application: PCT/JP2006/316701 WO 20060825
- International Announcement: WO2007/029523 WO 20070315
- Main IPC: H01L21/66
- IPC: H01L21/66

Abstract:
A method is provided, of manufacturing a material to be etched that can more preferably prevent a region to be etched from remaining as an un-etched region and reduce deviation of etched/un-etched regions. Patterning (a method of manufacturing a material to be etched) of a substrate 100, which is manufactured by performing etching through an opened region 10 by an etching mask M1, is performed by a first etching process and a second etching process that is performed after the first etching process. The second etching process is a process for etching a region including a region that is not etched by the first etching process. An un-etched region, which is the same as etched using a virtual etching mask M1′, is formed on the surface of an object to be etched by the first and second etching processes.
Public/Granted literature
- US20090197353A1 METHOD OF MANUFACTURING MATERIAL TO BE ETCHED Public/Granted day:2009-08-06
Information query
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