A method of manufacturing a semiconductor wafer, the method comprising providing a base wafer comprising a semiconductor substrate; preparing a first monocrystalline layer comprising semiconductor regions; performing a first layer transfer of the first monocrystalline layer on top of the semiconductor substrate; preparing a second monocrystalline layer comprising semiconductor regions; performing a second layer transfer of the second monocrystalline layer on top of the first monocrystalline layer; and etching portions of the first monocrystalline layer and portions of the second monocrystalline layer.