发明授权
- 专利标题： Circuit board and method for jointing circuit board
- 专利标题（中）： 电路板及接线方法
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申请号： US12427991申请日： 2009-04-22
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公开(公告)号： US08115109B2公开(公告)日： 2012-02-14
- 发明人: Masayoshi Koyama , Norihito Tsukahara , Susumu Matsuoka
- 申请人： Masayoshi Koyama , Norihito Tsukahara , Susumu Matsuoka
- 申请人地址： JP Osaka
- 专利权人： Panasonic Corporation
- 当前专利权人： Panasonic Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： Steptoe & Johnson LLP
- 优先权： JP2008-113553 20080424
- 主分类号： H05K1/11
- IPC分类号： H05K1/11
摘要：
A circuit board in which end faces (36a) of wires are located in positions withdrawn from the end in a joint region of a first board (31a), end faces (36b) of wires are located in positions withdrawn from the end in a joint region of a second board (31b), a gap (W) between the end faces (36a) of the wires of the first board (31a) and the end faces (36b) of the wires of the second board (31b) is filled with a conductor (16A), and the first board (31a) and the second board (31b) are jointed by means of a resin.
公开/授权文献
- US20090266592A1 CIRCUIT BOARD AND METHOD FOR JOINTING CIRCUIT BOARD 公开/授权日：2009-10-29
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