Invention Grant
- Patent Title: Light emitting diode package and method of manufacturing the same
- Patent Title (中): 发光二极管封装及其制造方法
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Application No.: US11709764Application Date: 2007-02-23
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Publication No.: US08115214B2Publication Date: 2012-02-14
- Inventor: Won-Jin Son
- Applicant: Won-Jin Son
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2006-0017476 20060223
- Main IPC: H01L27/15
- IPC: H01L27/15
Abstract:
Provided is a light emitting diode package and a method of manufacturing the same. The light emitting diode package includes a package main body with a cavity, a plurality of light emitting diode chips, a wire, and a plurality of lead frames. The plurality of light emitting diode chips are mounted in the cavity. The wire is connected to an electrode of at least one light emitting diode chip. The plurality of lead frames are formed in the cavity, and at least one lead frame is electrically connected to the light emitting diode chip or a plurality of wires.
Public/Granted literature
- US20070194333A1 Light emitting diode package and method of manufacturing the same Public/Granted day:2007-08-23
Information query
IPC分类:
