发明授权
US08115302B2 Electronic module with carrier substrates, multiple integrated circuit (IC) chips and microchannel cooling device
有权
具有载体基板的电子模块,多个集成电路(IC)芯片和微通道冷却装置
- 专利标题: Electronic module with carrier substrates, multiple integrated circuit (IC) chips and microchannel cooling device
- 专利标题(中): 具有载体基板的电子模块,多个集成电路(IC)芯片和微通道冷却装置
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申请号: US12134873申请日: 2008-06-06
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公开(公告)号: US08115302B2公开(公告)日: 2012-02-14
- 发明人: Paul S. Andry , Evan G. Colgan
- 申请人: Paul S. Andry , Evan G. Colgan
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: F. Chau & Associates, LLC
- 代理商 Louis J. Percello
- 主分类号: H01L23/473
- IPC分类号: H01L23/473
摘要:
Apparatus and methods are provided for integrating microchannel cooling modules within high-density electronic modules (e.g., chip packages, system-on-a-package modules, etc.,) comprising multiple high-performance IC chips. Electronic modules are designed such that high-performance (high power) IC chips are disposed in close proximity to the integrated cooling module (or cooling plate) for effective heat extraction. Moreover, electronic modules which comprise large surface area silicon carriers with multiple chips face mounted thereon are designed such that integrated silicon cooling modules are rigidly bonded to the back surfaces of such chips to increase the structural integrity of the silicon carriers.