发明授权
- 专利标题: Multi-chip packaged LED light source
- 专利标题(中): 多芯片封装LED光源
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申请号: US12871704申请日: 2010-08-30
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公开(公告)号: US08115385B2公开(公告)日: 2012-02-14
- 发明人: Aizar Abdul Karim Norfidathul , Chiau Jin Lee , Kheng Leng Tan , Keat Chuan Ng , Kiam Soon Ong
- 申请人: Aizar Abdul Karim Norfidathul , Chiau Jin Lee , Kheng Leng Tan , Keat Chuan Ng , Kiam Soon Ong
- 申请人地址: SG Singapore
- 专利权人: Avago Technologies ECBU IP (Singapore) Pte. Ltd.
- 当前专利权人: Avago Technologies ECBU IP (Singapore) Pte. Ltd.
- 当前专利权人地址: SG Singapore
- 主分类号: H01J1/62
- IPC分类号: H01J1/62
摘要:
A light source having a lead frame, a body, and a plurality of dies, each die having an LED thereon is disclosed. The body includes a top surface, a bottom surface and a plurality of side surfaces. The lead frame includes first, second, and third sections, the first section includes a die mounting area having a first protrusion that passes through the body and terminates in a pad on the bottom surface. The second and third sections each include a protrusion that is bent to form first and second leads that run along one of the side surfaces. Each die is bonded to the die mounting area such that a first contact is electrically connected to the die mounting area, and a second contact is connected to one of the second and third sections. The first protrusion of the first section provides improved heat transfer.
公开/授权文献
- US20100320485A1 MULTI-CHIP PACKAGED LED LIGHT SOURCE 公开/授权日:2010-12-23
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