Invention Grant
- Patent Title: Device for measuring metal/semiconductor contact resistivity
- Patent Title (中): 用于测量金属/半导体接触电阻率的装置
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Application No.: US12123758Application Date: 2008-05-20
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Publication No.: US08115503B2Publication Date: 2012-02-14
- Inventor: Maud Vinet
- Applicant: Maud Vinet
- Applicant Address: FR Paris
- Assignee: Commissariat a l'Energie Atomique
- Current Assignee: Commissariat a l'Energie Atomique
- Current Assignee Address: FR Paris
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: FR0755405 20070601
- Main IPC: G01R27/08
- IPC: G01R27/08 ; G01R31/26

Abstract:
A device for measuring the resistivity ρc of an interface between a semiconductor and a metal, including at least: one dielectric layer, at least one semiconductor-based element of a substantially rectangular shape, which is arranged on the dielectric layer, having a lengthwise L and widthwise W face in contact with the dielectric layer and having a thickness t, and at least two interface portions containing the metal or an alloy of said semiconductor and said metal, wherein each of two opposing faces of the semiconductor element, having a surface equal to t×W and being perpendicular to the face in contact with the dielectric layer, being completely covered by one of the interface portions.
Public/Granted literature
- US20080297180A1 DEVICE FOR MEASURING METAL/SEMICONDUCTOR CONTACT RESISTIVITY Public/Granted day:2008-12-04
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