发明授权
- 专利标题： Heating apparatus, substrate processing apparatus, and method of manufacturing semiconductor devices
- 专利标题（中）： 加热装置，基板处理装置以及半导体装置的制造方法
-
申请号： US12213823申请日： 2008-06-25
-
公开(公告)号： US08116618B2公开(公告)日： 2012-02-14
- 发明人: Akira Hayashida , Masaaki Ueno , Masakazu Shimada , Masashi Sugishita , Toshimitsu Miyata , Kimio Kitamura , Kenji Tanaka , Jyunichi Nishihara
- 申请人： Akira Hayashida , Masaaki Ueno , Masakazu Shimada , Masashi Sugishita , Toshimitsu Miyata , Kimio Kitamura , Kenji Tanaka , Jyunichi Nishihara
- 申请人地址： JP Tokyo JP Osaka
- 专利权人： Hitachi Kokusai Electric Inc.,Teitokusha Co., Ltd.
- 当前专利权人： Hitachi Kokusai Electric Inc.,Teitokusha Co., Ltd.
- 当前专利权人地址： JP Tokyo JP Osaka
- 代理机构： Rader, Fishman & Grauer PLLC
- 优先权： JP2007-166998 20070625; JP2008-154369 20080612
- 主分类号： A45D20/40
- IPC分类号： A45D20/40 ; A21B2/00
摘要：
A heating apparatus comprises a wall for surrounding and defining a heating space, a heating element mounted on the inner side of the wall, reflecting members for reflecting the heat emitted from the heating element. Also, a moving unit joined to one end of each of the reflecting members for moving the reflecting members. Moreover, pivotal members joined to the reflecting members beside more their respective other side than one side of the reflecting members for controlling as pivots the movement of the reflecting member driven by the moving unit.