发明授权
- 专利标题： Junction temperature prediction method and apparatus for use in a power conversion module
- 专利标题（中）： 用于功率转换模块的结温预测方法和装置
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申请号： US12033936申请日： 2008-02-20
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公开(公告)号： US08117008B2公开(公告)日： 2012-02-14
- 发明人: Russel J. Kerkman , Lixiang Wei , Richard A. Lukaszewski , Brian P. Brown , Neil Gollhardt , Bruce W. Weiss
- 申请人： Russel J. Kerkman , Lixiang Wei , Richard A. Lukaszewski , Brian P. Brown , Neil Gollhardt , Bruce W. Weiss
- 申请人地址： US OH Mayfield Heights
- 专利权人： Rockwell Automation Technologies, Inc.
- 当前专利权人： Rockwell Automation Technologies, Inc.
- 当前专利权人地址： US OH Mayfield Heights
- 代理机构： Quarles & Brady LLP
- 代理商 Alexander R. Kuszewski; John M. Miller
- 主分类号： G06F11/30
- IPC分类号： G06F11/30
摘要：
A method and apparatus for predicting junction device temperature of at least a first switching device in a power conversion module that includes the first switching device and at least a second switching device, the method comprising the steps of identifying a cross thermal impedance value indicative of how the temperature of the second switching device effects the first switching device temperature and using the cross thermal impedance value to predict the temperature of the at least a first switching device.
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