发明授权
- 专利标题： Semiconductor manufacturing apparatus, liquid container, and semiconductor device manufacturing method
- 专利标题（中）： 半导体制造装置，液体容器和半导体装置的制造方法
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申请号： US12659071申请日： 2010-02-24
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公开(公告)号： US08119196B2公开(公告)日： 2012-02-21
- 发明人: Osamu Arisumi , Masahiro Kiyotoshi , Katsuhiko Hieda
- 申请人： Osamu Arisumi , Masahiro Kiyotoshi , Katsuhiko Hieda
- 申请人地址： JP Tokyo
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JP Tokyo
- 代理机构： Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- 优先权： JP2004-311927 20041027
- 主分类号： B05D3/12
- IPC分类号： B05D3/12
摘要：
A semiconductor manufacturing apparatus comprises a discharge portion discharging a coating liquid onto a substrate; a gas supply tube supplying an inert gas into a liquid container that contains the coating liquid, and pressurizing an interior of the liquid container; a coating liquid supply tube airtightly supplying the coating liquid from the liquid container to the discharge portion using pressurization from the gas supply tube; a first connecting portion capable of attaching and detaching the liquid container to and from the coating liquid supply tube; a second connecting portion capable of attaching and detaching the liquid container to and from the gas supply tube; and a solvent supply tube supplying a solvent, which can dissolve the coating liquid, to the first connecting portion.
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