发明授权
- 专利标题： Semiconductor chip, wafer stack package using the same, and methods of manufacturing the same
- 专利标题（中）： 半导体芯片，使用其的晶片堆叠封装及其制造方法
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申请号： US12817304申请日： 2010-06-17
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公开(公告)号： US08119448B2公开(公告)日： 2012-02-21
- 发明人: Son-Kwan Hwang , In-Young Lee , Ho-Jin Lee , Dong-Hyeon Jang
- 申请人： Son-Kwan Hwang , In-Young Lee , Ho-Jin Lee , Dong-Hyeon Jang
- 申请人地址： KR Gyeonggi-do
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Gyeonggi-do
- 代理机构： Harness, Dickey & Pierce, P.L.C.
- 优先权： KR10-2009-0102980 20091028
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A semiconductor chip comprises a substrate including a front surface and a rear surface, the substrate having a first via hole formed in the front surface and a second via hole formed in the rear surface, a first conductive plug formed on the substrate, the first conductive plug including a first portion formed in the first via hole and a second portion protruding from the front surface of the substrate, and a second conductive plug formed on the first conductive plug, the second conductive plug having a smaller cross-sectional area than the first conductive plug.
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