发明授权
- 专利标题： Method of manufacturing an electronic part mounting structure
- 专利标题（中）： 电子部件安装结构的制造方法
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申请号： US12278481申请日： 2007-03-06
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公开(公告)号： US08119449B2公开(公告)日： 2012-02-21
- 发明人: Daisuke Sakurai , Yoshihiko Yagi
- 申请人： Daisuke Sakurai , Yoshihiko Yagi
- 申请人地址： JP Osaka
- 专利权人： Panasonic Corporation
- 当前专利权人： Panasonic Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： McDermott Will & Emery LLP
- 优先权： JP2006-068801 20060314; JP2006-069057 20060314
- 国际申请： PCT/JP2007/054280 WO 20070306
- 国际公布： WO2007/105535 WO 20070920
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
An electronic part mounting structure includes electronic part having a plurality of electrode terminals, a substrate provided with connection terminals in locations corresponding to these electrode terminals, and protruding electrode for connecting one of electrode terminals and one of connection terminals, where electrode terminal of electronic part and connection terminal of substrate are connected through protruding electrode and protruding electrode is formed of a conductive resin including a photosensitive resin and a conductive filler.
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