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US08119547B2 Method of manufacturing a semiconductor integrated circuit device including elimination of static charge of a treated wafer 有权
制造半导体集成电路器件的方法,包括消除经处理晶片的静电荷

Method of manufacturing a semiconductor integrated circuit device including elimination of static charge of a treated wafer
摘要:
A sealed type container accommodating a semiconductor substrate is positioned to a load port of a semiconductor manufacturing apparatus. The semiconductor substrate is taken out of the container. An ionizer is used for static-charge-eliminating the semiconductor substrates before and after process treatment in a transport area between the load port and a treatment section. The static-charge-eliminated semiconductor substrate is accommodated in the container positioned to the load port. Thus, it is possible to decrease foreign materials adhering to the semiconductor substrate and errors in handling the semiconductor substrate.
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