Invention Grant
- Patent Title: Printed circuit board
- Patent Title (中): 印刷电路板
-
Application No.: US12098474Application Date: 2008-04-07
-
Publication No.: US08120927B2Publication Date: 2012-02-21
- Inventor: Nan-Jang Chen , Hong-Chin Lin
- Applicant: Nan-Jang Chen , Hong-Chin Lin
- Applicant Address: TW Hsin-Chu
- Assignee: Mediatek Inc.
- Current Assignee: Mediatek Inc.
- Current Assignee Address: TW Hsin-Chu
- Agency: Thomas|Kayden
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/14

Abstract:
A printed circuit board is disclosed. The printed circuit board comprises a substrate having a top surface and a bottom surface. A ground plane is on the bottom surface. A signal trace is on the top surface along a first direction. At least two isolated power planes are on the top surface adjacent to opposite sides of the signal trace, respectively. A conductive connection along a second direction couples to the two power planes, across the signal trace without electrically connecting to the signal trace, wherein the signal trace doesn't pass over any split of the ground plane.
Public/Granted literature
- US20090251876A1 PRINTED CIRCUIT BOARD Public/Granted day:2009-10-08
Information query