发明授权
- 专利标题: Integrated circuit with intra-chip and extra-chip RF communication
- 专利标题(中): 具有片内和片外RF通信的集成电路
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申请号: US12210415申请日: 2008-09-15
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公开(公告)号: US08121541B2公开(公告)日: 2012-02-21
- 发明人: Ahmadreza Reza Rofougaran
- 申请人: Ahmadreza Reza Rofougaran
- 申请人地址: US CA Irvine
- 专利权人: Broadcom Corporation
- 当前专利权人: Broadcom Corporation
- 当前专利权人地址: US CA Irvine
- 代理机构: Garlick Harrison & Markison
- 代理商 Bruce E. Stuckman
- 主分类号: H04B5/00
- IPC分类号: H04B5/00
摘要:
An integrated circuit includes a first integrated circuit die having a first circuit and a first intra-chip interface and a second integrated circuit die having a second circuit and a second intra-chip interface and a remote interface, wherein the first intra-chip interface and the second intra-chip interface electro-magnetically communicate first signals between the first circuit and the second circuit, and wherein the remote interface is coupled to engage in electromagnetic communications with a remote device. In an embodiment of the present invention, a shielding element shields the electromagnetic communications with the remote device from the electromagnetic communication of the first signals. In other embodiments, antenna beam patterns or differing polarizations are used to isolate the electromagnetic communications with the remote device from the electromagnetic communication of the first signals.
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