Invention Grant
- Patent Title: Modular extruded heat sink
- Patent Title (中): 模块化挤压散热器
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Application No.: US12471575Application Date: 2009-05-26
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Publication No.: US08123382B2Publication Date: 2012-02-28
- Inventor: Ellis W. Patrick , Evans Edward Thompson, III
- Applicant: Ellis W. Patrick , Evans Edward Thompson, III
- Applicant Address: US TX Houston
- Assignee: Cooper Technologies Company
- Current Assignee: Cooper Technologies Company
- Current Assignee Address: US TX Houston
- Agency: King & Spalding LLP
- Main IPC: F21V29/00
- IPC: F21V29/00

Abstract:
A modular heat sink includes one or more heat sink sections interconnected sequentially to each other to form a polar array. Each heat sink section includes a first connecting part and a second connecting part, where the first connecting part is configured to couple with the second connecting part of another heat sink section. Once assembled, the modular heat sink includes a channel formed substantially through the center of the modular heat sink. Each heat sink section is manufactured using an extrusion process. The assembled modular heat sink has one or more hollow portions within the overall shape that cannot be fabricated in a single extrusion process. One or more LEDs are coupled to the outer surface of the modular heat sink. The modular heat sink, with LEDs coupled thereto, is coupled to a wireway tube and mounted to a post-top light fixture to form an LED luminaire.
Public/Granted literature
- US20100091495A1 Modular Extruded Heat Sink Public/Granted day:2010-04-15
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