A contact capable of facilitating adjustment of impedance and ensuring a high holding force when held in a housing. To a contact portion capable of being brought into contact with a pad on a module substrate, a spring portion is connected for pressing the contact portion against the pad. A press-fitting portion that is press-fitted into the housing is connected to the spring portion, and has a connecting portion connected thereto. A terminal portion to be connected to a pad on a motherboard is connected to the connecting portion. The spring portion is bent in a manner folded back from the rear end of the press-fitting portion in the inserting direction, toward a front side in the inserting direction. The connecting portion extends from the rear end of the press-fitting portion in the inserting direction, toward a rear side in the inserting direction.