Invention Grant
- Patent Title: Substrate supporting unit and apparatus for treating substrate using the substrate supporting unit
- Patent Title (中): 基板支撑单元和使用基板支撑单元处理基板的装置
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Application No.: US12284840Application Date: 2008-09-25
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Publication No.: US08123900B2Publication Date: 2012-02-28
- Inventor: Hye-Son Jung , Seung-Ho Lee
- Applicant: Hye-Son Jung , Seung-Ho Lee
- Applicant Address: KR Chungcheongnam-do
- Assignee: Semes Co. Ltd.
- Current Assignee: Semes Co. Ltd.
- Current Assignee Address: KR Chungcheongnam-do
- Agency: Jenkins, Wilson, Taylor & Hunt, P.A.
- Priority: KR10-2007-0102976 20071012
- Main IPC: H01L21/304
- IPC: H01L21/304 ; C23C14/50
Abstract:
Provided are a substrate supporting unit and a substrate treating apparatus using the substrate supporting unit. The substrate supporting unit comprises a base plate and a supporting portion formed on the base plate. The supporting portion comprises two supporting rods and a plurality of supporting members. The two supporting rods extend in a predetermined direction to be separated from each other. The plurality of supporting members is disposed to be separated from each other in the predetermined direction. Each of the supporting members connects the supporting rods.
Public/Granted literature
- US20090145552A1 Substrate supporting unit and apparatus for treating substrate using the substrate supporting unit Public/Granted day:2009-06-11
Information query
IPC分类:
