Invention Grant
- Patent Title: Method and system for packaging a display
- Patent Title (中): 用于包装显示器的方法和系统
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Application No.: US11150496Application Date: 2005-06-10
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Publication No.: US08124434B2Publication Date: 2012-02-28
- Inventor: Brian J. Gally , William J. Cummings , Lauren Palmateer , Philip D. Floyd , Clarence Chui
- Applicant: Brian J. Gally , William J. Cummings , Lauren Palmateer , Philip D. Floyd , Clarence Chui
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM MEMS Technologies, Inc.
- Current Assignee: QUALCOMM MEMS Technologies, Inc.
- Current Assignee Address: US CA San Diego
- Agency: Knobbe, Martens, Olson & Bear LLP
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A package structure and method of packaging for an interferometric modulator. A transparent substrate having an interferometric modulator formed thereon is provided. A backplane is joined to the transparent substrate with a seal where the interferometric modulator is exposed to the surrounding environment through an opening in either the backplane or the seal. The opening is sealed after the transparent substrate and backplane are joined and after any desired desiccant, release material, and/or self-aligning monolayer is introduced into the package structure.
Public/Granted literature
- US20060076637A1 Method and system for packaging a display Public/Granted day:2006-04-13
Information query
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