Invention Grant
US08124881B2 Printed board and portable electronic device which uses this printed board
有权
使用该印刷电路板的印刷电路板和便携式电子设备
- Patent Title: Printed board and portable electronic device which uses this printed board
- Patent Title (中): 使用该印刷电路板的印刷电路板和便携式电子设备
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Application No.: US12394889Application Date: 2009-02-27
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Publication No.: US08124881B2Publication Date: 2012-02-28
- Inventor: Noriyuki Shirasawa
- Applicant: Noriyuki Shirasawa
- Applicant Address: JP Kyoto
- Assignee: Kyocera Corporation
- Current Assignee: Kyocera Corporation
- Current Assignee Address: JP Kyoto
- Agency: DLA Piper LLP (US)
- Priority: JP2008-046761 20080227
- Main IPC: H05K1/16
- IPC: H05K1/16 ; H05K7/00 ; H01L23/48
Abstract:
A printed board comprising a packaging surface on which an electronic component is packaged, an adhesion prohibited portion which is provided at a region of the printed board different from a region where the electronic component is provided, and to which adhesion of the adhesive material is prohibited, and a blocking step portion which is formed at a region between the region where the electronic component is provided and the region where the adhesion prohibited portion is provided, which blocks any adhesive material which has spilled out from between the bottom surface of the electronic component and the packaging surface from reaching the adhesion prohibited portion.
Public/Granted literature
- US20090211795A1 Printed Board And Portable Electronic Device Which Uses This Printed Board Public/Granted day:2009-08-27
Information query
