Invention Grant
- Patent Title: Printed circuit board
- Patent Title (中): 印刷电路板
-
Application No.: US12693418Application Date: 2010-01-25
-
Publication No.: US08124884B2Publication Date: 2012-02-28
- Inventor: Yung-Chieh Chen , Cheng-Hsien Lee , Shou-Kuo Hsu
- Applicant: Yung-Chieh Chen , Cheng-Hsien Lee , Shou-Kuo Hsu
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201010300313 20100114
- Main IPC: H05K1/11
- IPC: H05K1/11

Abstract:
A printed circuit board (PCB) includes a positive differential signal line including first and second segments, a negative differential signal line including third and fourth segments, first and second connecting elements soldered on opposite surfaces of the PCB. The first segment and the fourth segment are located in a first straight line which has a first permittivity. The third segment and the second segment are located in a second straight line which has a second permittivity different from the first permittivity. The first connecting element is connected between the first segment and the second segment. The second connecting element is connected between the third segment and the fourth segment.
Public/Granted literature
- US20110168437A1 PRINTED CIRCUIT BOARD Public/Granted day:2011-07-14
Information query