发明授权
- 专利标题: Semiconductor light emitting element and method for manufacturing the same
- 专利标题(中): 半导体发光元件及其制造方法
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申请号: US12428768申请日: 2009-04-23
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公开(公告)号: US08124969B2公开(公告)日: 2012-02-28
- 发明人: Naochika Horio
- 申请人: Naochika Horio
- 申请人地址: JP Tokyo
- 专利权人: Stanley Electric Co., Ltd.
- 当前专利权人: Stanley Electric Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Holtz, Holtz, Goodman & Chick, PC
- 优先权: JP2008-114399 20080424
- 主分类号: H01L33/00
- IPC分类号: H01L33/00
摘要:
A ZnO-based semiconductor light emitting element includes a ZnO-based semiconductor layer formed on a rectangular sapphire A-plane substrate having a principal surface lying in the A-plane {11-20}. The substrate has a thickness of 50 to 200 μm and is surrounded by two parallel first side edges forming an angle in a range of 52.7° to 54.7° with respect to the m-axis orthogonal to the c-axis and two parallel second side edges orthogonal to the first side edges. The light emitting element is obtained by: forming, on a surface of the sapphire A-plane substrate opposite to the surface on which the ZnO-based semiconductor layer is formed, first scribed grooves forming an angle in a range of 52.7° to 54.7° with respect to the m-axis and second scribed grooves orthogonal to the first scribed grooves; and breaking the substrate along the first scribed grooves and then along the second scribed grooves.
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