Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
-
Application No.: US12095663Application Date: 2006-12-01
-
Publication No.: US08124976B2Publication Date: 2012-02-28
- Inventor: Koichi Takeda , Kiyoshi Takeuchi
- Applicant: Koichi Takeda , Kiyoshi Takeuchi
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2005-349578 20051202
- International Application: PCT/JP2006/324102 WO 20061201
- International Announcement: WO2007/063990 WO 20070607
- Main IPC: H01L27/11
- IPC: H01L27/11

Abstract:
The present invention provides a semiconductor device including SRAM cell units each including a data holding section made up of a pair of driving transistors and a pair of load transistors, a data write section made up of a pair of access transistors, and a data read section made up of an access transistor and a driving transistor, wherein each of the transistors includes a semiconductor layer projecting upward from a base plane, a gate electrode extending from a top to opposite side surfaces of the semiconductor layer so as to stride the semiconductor layer, a gate insulating film between the gate electrode and the semiconductor layer, and source/drain areas, a longitudinal direction of each of the semiconductor layers is provided along a first direction, and for all the corresponding transistors between the SRAM cell units adjacent to each other in the first direction, the semiconductor layer in one of the corresponding transistors is located on a center line of the semiconductor layer along the first direction in the other transistor.
Public/Granted literature
- US20100289091A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2010-11-18
Information query
IPC分类: