Invention Grant
US08124976B2 Semiconductor device and method of manufacturing the same 有权
半导体装置及其制造方法

  • Patent Title: Semiconductor device and method of manufacturing the same
  • Patent Title (中): 半导体装置及其制造方法
  • Application No.: US12095663
    Application Date: 2006-12-01
  • Publication No.: US08124976B2
    Publication Date: 2012-02-28
  • Inventor: Koichi TakedaKiyoshi Takeuchi
  • Applicant: Koichi TakedaKiyoshi Takeuchi
  • Applicant Address: JP Tokyo
  • Assignee: NEC Corporation
  • Current Assignee: NEC Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Sughrue Mion, PLLC
  • Priority: JP2005-349578 20051202
  • International Application: PCT/JP2006/324102 WO 20061201
  • International Announcement: WO2007/063990 WO 20070607
  • Main IPC: H01L27/11
  • IPC: H01L27/11
Semiconductor device and method of manufacturing the same
Abstract:
The present invention provides a semiconductor device including SRAM cell units each including a data holding section made up of a pair of driving transistors and a pair of load transistors, a data write section made up of a pair of access transistors, and a data read section made up of an access transistor and a driving transistor, wherein each of the transistors includes a semiconductor layer projecting upward from a base plane, a gate electrode extending from a top to opposite side surfaces of the semiconductor layer so as to stride the semiconductor layer, a gate insulating film between the gate electrode and the semiconductor layer, and source/drain areas, a longitudinal direction of each of the semiconductor layers is provided along a first direction, and for all the corresponding transistors between the SRAM cell units adjacent to each other in the first direction, the semiconductor layer in one of the corresponding transistors is located on a center line of the semiconductor layer along the first direction in the other transistor.
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