Invention Grant
- Patent Title: Main board and system for memory mounting test
- Patent Title (中): 主板和内存安装测试系统
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Application No.: US12662015Application Date: 2010-03-29
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Publication No.: US08125236B2Publication Date: 2012-02-28
- Inventor: Jung-Kuk Lee , Seung-Hee Lee
- Applicant: Jung-Kuk Lee , Seung-Hee Lee
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2009-0028027 20090401
- Main IPC: G01R31/00
- IPC: G01R31/00 ; G01R31/306
Abstract:
A main board according to example embodiments may include a substrate and at least one socket. The at least one socket may directly connect a memory module to the substrate in a direction parallel to the substrate. A memory mounting test system including the main board may occupy a smaller space, because the memory module is connected to the main board in a direction parallel to the main board.
Public/Granted literature
- US20100257416A1 Main board and system for memory mounting test Public/Granted day:2010-10-07
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