Invention Grant
- Patent Title: Capacitor devices with co-coupling electrode planes
- Patent Title (中): 具有共耦合电极平面的电容器件
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Application No.: US12390237Application Date: 2009-02-20
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Publication No.: US08125761B2Publication Date: 2012-02-28
- Inventor: Chien-Min Hsu , Min-Lin Lee , Shinn-Juh Lai , Chen-Hsuan Chiu
- Applicant: Chien-Min Hsu , Min-Lin Lee , Shinn-Juh Lai , Chen-Hsuan Chiu
- Applicant Address: TW Chutung, Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Chutung, Hsinchu
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
- Main IPC: H01G4/00
- IPC: H01G4/00

Abstract:
A capacitive module is provided. The capacitive module may include a first capacitor including a first electrode and a second electrode, one of the first electrode and the second electrode being coupled to at least one first conductive via and the other one of the first electrode and the second electrode being coupled to at least one second conductive via. The capacitive module may also include a second capacitor spaced apart from the first capacitor, the second capacitor including a third electrode and a fourth electrode, one of the third electrode and the fourth electrode being coupled to the at least one first conductive via and the other one of the third electrode and the fourth electrode being coupled to the at least one second conductive via. Furthermore, the capacitive module may include a first conductive plane being electrically coupled to a first plane with a first polarity through one of the at least one first conductive via and a second conductive plane being electrically coupled to a second plane with a second polarity, opposite to the first polarity, through one of the at least one second conductive via.
Public/Granted literature
- US20090213526A1 CAPACITOR DEVICES WITH CO-COUPLING ELECTRODE PLANES Public/Granted day:2009-08-27
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