发明授权
- 专利标题： Protective tape cutting method for semiconductor wafer and device of the same
- 专利标题（中）： 半导体晶圆的保护带切割方法及其装置
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申请号： US12276343申请日： 2008-11-23
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公开(公告)号： US08127647B2公开(公告)日： 2012-03-06
- 发明人: Naoki Ishii , Masayuki Yamamoto
- 申请人： Naoki Ishii , Masayuki Yamamoto
- 申请人地址： JP Osaka
- 专利权人： Nitto Denko Corporation
- 当前专利权人： Nitto Denko Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： Cheng Law Group, PLLC
- 优先权： JP2007-306104 20071127
- 主分类号： B32B38/04
- IPC分类号： B32B38/04
摘要：
A cutter blade is relatively moved along an outer periphery of a semiconductor wafer, and dust generated at a tape cutting site by the cutter blade and attached to an upper surface of the protective tape is collected with a dust collecting member which relatively moves with the cutter blade with respect to the semiconductor wafer, and the dust collected at a predetermined portion is suctioned and removed with a suction nozzle after the completion of tape cutting.
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