Invention Grant
- Patent Title: Liquid ejection substrate and liquid ejection head using same
- Patent Title (中): 液体喷射基板和使用其的液体喷射头
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Application No.: US12547655Application Date: 2009-08-26
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Publication No.: US08128206B2Publication Date: 2012-03-06
- Inventor: Takaaki Yamaguchi , Yoshiyuki Imanaka , Koichi Omata , Kousuke Kubo
- Applicant: Takaaki Yamaguchi , Yoshiyuki Imanaka , Koichi Omata , Kousuke Kubo
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon USA Inc. IP Division
- Priority: JP2008-222023 20080829
- Main IPC: B41J2/05
- IPC: B41J2/05

Abstract:
A liquid ejection substrate used to eject a liquid includes a substrate having an element row including a plurality of elements provided in a row, where each of the elements generates energy, drive circuits that drive and control the elements, a signal line that is shared by and connected to the drive circuits, the signal line being provided along the element row, and a heating portion generating heat used to heat the substrate, wherein the heating portion is provided so that the heating portion does not overlap the signal line with reference to a direction perpendicular to a face of the substrate.
Public/Granted literature
- US20100053243A1 LIQUID EJECTION SUBSTRATE AND LIQUID EJECTION HEAD USING SAME Public/Granted day:2010-03-04
Information query
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