发明授权
- 专利标题： Liquid discharge head substrate, liquid discharge head using the substrate, and manufacturing method therefor
- 专利标题（中）： 液体排出头基板，使用基板的排液头及其制造方法
-
申请号： US12841410申请日： 2010-07-22
-
公开(公告)号： US08129204B2公开(公告)日： 2012-03-06
- 发明人: Ichiro Saito , Teruo Ozaki , Takahiro Matsui , Sakai Yokoyama , Takuya Hatsui , Kazuaki Shibata
- 申请人： Ichiro Saito , Teruo Ozaki , Takahiro Matsui , Sakai Yokoyama , Takuya Hatsui , Kazuaki Shibata
- 申请人地址： JP Tokyo
- 专利权人： Canon Kabushiki Kaisha
- 当前专利权人： Canon Kabushiki Kaisha
- 当前专利权人地址： JP Tokyo
- 代理机构： Fitzpatrick, Cella, Harper & Scinto
- 优先权： JP2006-026019 20060202; JP2006-065815 20060310; JP2006-070818 20060315; JP2006-131415 20060510; JP2006-325987 20061201
- 主分类号： H01L21/02
- IPC分类号： H01L21/02
摘要：
Provided is a liquid discharge head substrate including: a substrate; a heating resistor layer formed on the substrate; a flow path for a liquid; a wiring layer stacked on the heating resistor layer and having an end portion which forms a step portion on the heating resistor layer; and a protective layer covering the heating resistor layer and the wiring layer including the step portion, and formed between the heating resistor layer and the flow path, in which the protective layer is formed by a Cat-CVD method.
公开/授权文献
信息查询
IPC分类:
