发明授权
US08129267B2 Alpha particle blocking wire structure and method fabricating same
有权
Alpha粒子阻挡线结构及其制造方法
- 专利标题: Alpha particle blocking wire structure and method fabricating same
- 专利标题(中): Alpha粒子阻挡线结构及其制造方法
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申请号: US12052881申请日: 2008-03-21
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公开(公告)号: US08129267B2公开(公告)日: 2012-03-06
- 发明人: Cyril Cabral, Jr. , K. Paul Muller , Kenneth P. Rodbell
- 申请人: Cyril Cabral, Jr. , K. Paul Muller , Kenneth P. Rodbell
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Schmeiser, Olsen & Watts
- 代理商 Louis J. Parcello
- 主分类号: H01L21/4763
- IPC分类号: H01L21/4763
摘要:
An alpha particle blocking structure and method of making the structure. The structure includes: a semiconductor substrate; a set of interlevel dielectric layers stacked from a lowermost interlevel dielectric layer closest to the substrate to a uppermost interlevel dielectric layer furthest from the substrate, each interlevel dielectric layer of the set of interlevel dielectric layers including electrically conductive wires, top surfaces of the wires substantially coplanar with top surfaces of corresponding interlevel dielectric layers; an electrically conductive tot final pad contacting a wire pad of the uppermost interlevel dielectric layer; an electrically conductive plating base layer contacting a top surface of the terminal pad; and a copper block on the plating base layer.