Invention Grant
US08129322B2 Photosensitive-resin remover composition and method of fabricating semiconductor device using the same
有权
光敏树脂去除剂组合物及使用该组合物的半导体器件的制造方法
- Patent Title: Photosensitive-resin remover composition and method of fabricating semiconductor device using the same
- Patent Title (中): 光敏树脂去除剂组合物及使用该组合物的半导体器件的制造方法
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Application No.: US13039501Application Date: 2011-03-03
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Publication No.: US08129322B2Publication Date: 2012-03-06
- Inventor: Ahn-Ho Lee , Junghun Lim , Young Taek Hong , Hyuntak Kim , Seonghwan Park , Baiksoon Choi , Seunghyun Ahn , Byungil Lee
- Applicant: Ahn-Ho Lee , Junghun Lim , Young Taek Hong , Hyuntak Kim , Seonghwan Park , Baiksoon Choi , Seunghyun Ahn , Byungil Lee
- Applicant Address: KR Suwon-si, Gyeonggi-do KR Seongnam-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.,Techno Semichem Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.,Techno Semichem Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do KR Seongnam-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2010-0019538 20100304
- Main IPC: G03F7/42
- IPC: G03F7/42
Abstract:
A photosensitive-resin remover composition includes an amine compound and de-ionized water, an amount of the de-ionized water being about 45% to about 99% by weight based on a total weight of the composition.
Public/Granted literature
- US20110218134A1 PHOTOSENSITIVE-RESIN REMOVER COMPOSITION AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME Public/Granted day:2011-09-08
Information query
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