Invention Grant
US08129623B2 Resin film, adhesive sheet, circuit board, and electronic apparatus
有权
树脂膜，粘合片，电路板和电子设备
- Patent Title: Resin film, adhesive sheet, circuit board, and electronic apparatus
- Patent Title (中): 树脂膜，粘合片，电路板和电子设备
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Application No.: US12162770Application Date: 2007-01-29
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Publication No.: US08129623B2Publication Date: 2012-03-06
- Inventor: Tadashi Nagasawa , Masaharu Shirai , Kenji Kume , Yutaka Tsukada
- Applicant: Tadashi Nagasawa , Masaharu Shirai , Kenji Kume , Yutaka Tsukada
- Applicant Address: JP Kyoto
- Assignee: Kyocera Corporation
- Current Assignee: Kyocera Corporation
- Current Assignee Address: JP Kyoto
- Agency: DLA Piper LLP (US)
- Priority: JP2006-021412 20060130; JP2006-053715 20060228
- International Application: PCT/JP2007/051420 WO 20070129
- International Announcement: WO2007/086568 WO 20070802
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K1/16 ; H05K1/11 ; B32B3/02
Abstract:
The invention relates to a resin film having a high adhesiveness to other materials, an adhesive sheet, a circuit board and an electronic apparatus in which an adhesive layer and the resin film are firmly adhered. A resin film (1) includes a plurality of projected portions (10) each having a filler (9) in an apex portion (10a) and a resin material. The projected portions (10) are formed on at least one surface of a sheet portion (16).
Public/Granted literature
- US20090314526A1 Resin Film, Adhesive Sheet, Circuit Board, and Electronic Apparatus Public/Granted day:2009-12-24
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