Invention Grant
- Patent Title: Arrangement for reducing the field strength on an electrode
- Patent Title (中): 用于降低电极上的场强的布置
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Application No.: US12518120Application Date: 2006-12-06
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Publication No.: US08129629B2Publication Date: 2012-03-06
- Inventor: Jens Hoppe , Dietmar Jahnel , Klaus Müller , Johann Schlager
- Applicant: Jens Hoppe , Dietmar Jahnel , Klaus Müller , Johann Schlager
- Applicant Address: DE Munich
- Assignee: Siemens Aktiengesellschaft
- Current Assignee: Siemens Aktiengesellschaft
- Current Assignee Address: DE Munich
- Agent Laurence A. Greenberg; Werner H. Stemer; Ralph E. Locher
- International Application: PCT/DE2006/002205 WO 20061206
- International Announcement: WO2008/067783 WO 20080612
- Main IPC: H05K9/00
- IPC: H05K9/00

Abstract:
An arrangement for reducing the electric field strength on the face of an electrode, wherein the face of the electrode is surrounded by at least one electric barrier, and a shielding electrode having a defined voltage potential is disposed in the vicinity of the face of the electrode. By using a retaining element that can be connected directly to the face of the electrode, the shielding wires can be quickly and easily positioned and fixed relative to the face of the electrode and the shielding electrode relative to the face.
Public/Granted literature
- US20100012346A1 Arrangement for rreducing the Field Strength on an Electrode Public/Granted day:2010-01-21
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