发明授权
- 专利标题： Semiconductor package and methods of manufacturing the same
- 专利标题（中）： 半导体封装及其制造方法
-
申请号： US12503274申请日： 2009-07-15
-
公开(公告)号： US08129840B2公开(公告)日： 2012-03-06
- 发明人: Chajea Jo , Uihyoung Lee , Jae-hyun Phee , Jeong-Woo Park , Ha-Young Yim
- 申请人： Chajea Jo , Uihyoung Lee , Jae-hyun Phee , Jeong-Woo Park , Ha-Young Yim
- 申请人地址： KR Suwon-si
- 专利权人： SAMSUNG Electronics Co., Ltd.
- 当前专利权人： SAMSUNG Electronics Co., Ltd.
- 当前专利权人地址： KR Suwon-si
- 代理机构： Stanzione & Kim, LLP
- 优先权： KR2008-68729 20080715
- 主分类号： H01L21/48
- IPC分类号： H01L21/48
摘要：
A semiconductor package and a method of manufacturing the semiconductor package. The semiconductor package include a substrate including a plurality of pads and a plurality of bumps evenly disposed on an entire region of the substrate regardless of an arrangement of the plurality of pads. According to the present invention, a simplification of a process can be accomplished, a cost of a process can be reduced, reliability can be improved and an under-filling can become easy.
公开/授权文献
信息查询
IPC分类:
