Invention Grant
- Patent Title: Semiconductor package and methods of manufacturing the same
- Patent Title (中): 半导体封装及其制造方法
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Application No.: US12503274Application Date: 2009-07-15
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Publication No.: US08129840B2Publication Date: 2012-03-06
- Inventor: Chajea Jo , Uihyoung Lee , Jae-hyun Phee , Jeong-Woo Park , Ha-Young Yim
- Applicant: Chajea Jo , Uihyoung Lee , Jae-hyun Phee , Jeong-Woo Park , Ha-Young Yim
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG Electronics Co., Ltd.
- Current Assignee: SAMSUNG Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Stanzione & Kim, LLP
- Priority: KR2008-68729 20080715
- Main IPC: H01L21/48
- IPC: H01L21/48
Abstract:
A semiconductor package and a method of manufacturing the semiconductor package. The semiconductor package include a substrate including a plurality of pads and a plurality of bumps evenly disposed on an entire region of the substrate regardless of an arrangement of the plurality of pads. According to the present invention, a simplification of a process can be accomplished, a cost of a process can be reduced, reliability can be improved and an under-filling can become easy.
Public/Granted literature
- US20100013094A1 SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING THE SAME Public/Granted day:2010-01-21
Information query
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