Invention Grant
US08134187B2 Integrated mask-programmable logic devices with multiple metal levels and manufacturing process thereof
有权
具有多种金属级别的集成掩模可编程逻辑器件及其制造工艺
- Patent Title: Integrated mask-programmable logic devices with multiple metal levels and manufacturing process thereof
- Patent Title (中): 具有多种金属级别的集成掩模可编程逻辑器件及其制造工艺
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Application No.: US12343621Application Date: 2008-12-24
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Publication No.: US08134187B2Publication Date: 2012-03-13
- Inventor: Patrik Vacula , Milos Vacula , Milan Lzicar
- Applicant: Patrik Vacula , Milos Vacula , Milan Lzicar
- Applicant Address: CZ Prague
- Assignee: STMicroelectronics Design and Application s.r.o.
- Current Assignee: STMicroelectronics Design and Application s.r.o.
- Current Assignee Address: CZ Prague
- Agency: Wolf, Greenfield & Sacks, P.C.
- Priority: EP07150488 20071229
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/00 ; H01L23/48 ; H01L27/10
Abstract:
Integrated mask-programmable device, having a plurality of metal levels including a top metal level, a bottom metal level and a first intermediate metal level formed between the top and bottom metal levels, and a plurality of via levels arranged between the bottom and the first intermediate metal levels and between the first intermediate and the top metal levels and connecting each metal level to adjacent metal levels. The plurality of metal levels forms a first, a second and at least a third terminal, the top and bottom metal levels having at least two metal regions, and the first intermediate metal level having at least three metal regions. The first terminal is connected to third terminal or the second terminal is connected to the third terminal by modifying a single metal or via level.
Public/Granted literature
- US20090166683A1 FLEXIBLE LAYOUT FOR INTEGRATED MASK-PROGRAMMABLE LOGIC DEVICES AND MANUFACTURING PROCESS THEREOF Public/Granted day:2009-07-02
Information query
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