发明授权
US08134233B2 Method and apparatus for providing electrically isolated closely spaced features on a printed circuit board
失效
用于在印刷电路板上提供电隔离的紧密间隔的特征的方法和装置
- 专利标题: Method and apparatus for providing electrically isolated closely spaced features on a printed circuit board
- 专利标题(中): 用于在印刷电路板上提供电隔离的紧密间隔的特征的方法和装置
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申请号: US11830348申请日: 2007-07-30
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公开(公告)号: US08134233B2公开(公告)日: 2012-03-13
- 发明人: Jerzy Wielgus , Daniel R. Gamota , Tomasz L. Klosowiak , John B. Szczech , Kin P. Tsui
- 申请人: Jerzy Wielgus , Daniel R. Gamota , Tomasz L. Klosowiak , John B. Szczech , Kin P. Tsui
- 申请人地址: US IL Schaumburg
- 专利权人: Motorola Solutions, Inc.
- 当前专利权人: Motorola Solutions, Inc.
- 当前专利权人地址: US IL Schaumburg
- 主分类号: H01L23/34
- IPC分类号: H01L23/34 ; H05K7/00
摘要:
A method and apparatus for forming controlled stress fractures in metal produces electrically isolated, closely spaced circuit sub-entities for use on a metallized printed wiring board. A polymeric substrate has a layer of metal adhered to the surface, and the metal layer is formed into entities. Each entity has a fracture initiating feature formed into it, which serves to initiate and/or direct a stress crack that is induced in the metal. The entities are fractured in a controlled manner by subjecting the substrate and the entities to mechanical stress by a rapid thermal excursion, creating a stress fracture in the entity extending from the fracture initiating feature. The stress fracture divides each entity into two or more sub-entities that are electrically isolated from each other by the stress fracture. The resulting structure can be used to form circuitry requiring very fine spaces for high density printed circuit boards. The rapid thermal stress may be induced by a high intensity, strobed xenon arc lamp.