New wiring terminations and methods are disclosed. The terminations may be incorporated into any suitable device such as wiring device which comprises a housing having a plurality of wire terminations. At least one of the plurality of wire terminations comprises a conductive surface and an element. The conductive surface is at least partially disposed within the housing. The element is movably mounted at least partially within the housing and is tool-lessly movable between at least a first position and a second position. The first position of the element actuates the termination such that the termination receives a wire and the second position of the element actuates the termination to removably clamp the wire.