Invention Grant
US08137641B2 Microfluidic module including an adhesiveless self-bonding rebondable polyimide
有权
微流控模块包括无粘合剂自粘性可重聚聚酰亚胺
- Patent Title: Microfluidic module including an adhesiveless self-bonding rebondable polyimide
- Patent Title (中): 微流控模块包括无粘合剂自粘性可重聚聚酰亚胺
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Application No.: US13028550Application Date: 2011-02-16
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Publication No.: US08137641B2Publication Date: 2012-03-20
- Inventor: Donald R. Moles
- Applicant: Donald R. Moles
- Applicant Address: US OH Yellow Springs
- Assignee: YSI Incorporated
- Current Assignee: YSI Incorporated
- Current Assignee Address: US OH Yellow Springs
- Agency: Thompson Hine LLP
- Main IPC: C03C25/68
- IPC: C03C25/68 ; B32B38/10 ; B32B37/02
Abstract:
A method of making a microfluidic module is disclosed that includes forming a fluid flow channel in a self-bonding rebondable polyimide film to provide a channel sheet, the self-bonding rebondable polyimide film having a first mask layer self-bonded thereto; removing the first mask layer from the channel sheet after forming the fluid flow channel; and self-bonding the surface of the channel sheet exposed by removal of the first mask layer to a cover sheet.
Public/Granted literature
- US20110132870A1 Microfluidic Module Including An Adhesiveless Self-Bonding Rebondable Polyimide Public/Granted day:2011-06-09
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