发明授权
- 专利标题: Heat-resistant DNA ligase with high reactivity
- 专利标题(中): 耐高温DNA连接酶具有高反应性
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申请号: US12390767申请日: 2009-02-23
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公开(公告)号: US08137943B2公开(公告)日: 2012-03-20
- 发明人: Hirokazu Nishida , Maiko Tanabe
- 申请人: Hirokazu Nishida , Maiko Tanabe
- 申请人地址: JP Tokyo
- 专利权人: Hitachi, Ltd.
- 当前专利权人: Hitachi, Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Mattingly & Malur, PC
- 主分类号: C12N9/00
- IPC分类号: C12N9/00 ; C07K1/00 ; C07H21/04
摘要:
Thermostable DNA ligases with enhanced DNA binding activity and reaction activity are obtained. These modified thermostable DNA ligases having enhanced DNA binding activity compared to the wild type can be obtained by substituting a negatively charged amino acid (for example, the amino acid corresponding to the aspartic acid at position 540 of SEQ ID NO: 1) present at the N-terminal side of the C-terminal helix moiety of thermostable DNA ligases from thermophilic bacteria, hyperthermophilic bacteria, thermophilic archaea, or hyperthermophilic archaea, with a non-negatively charged amino acid (for example, alanine, serine, arginine, or lysine).
公开/授权文献
- US20110053147A1 HEAT-RESISTANT DNA LIGASE WITH HIGH REACTIVITY 公开/授权日:2011-03-03
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