Invention Grant
US08138000B2 Methods for forming semiconductor light emitting devices and submounts
有权
用于形成半导体发光器件和底座的方法
- Patent Title: Methods for forming semiconductor light emitting devices and submounts
- Patent Title (中): 用于形成半导体发光器件和底座的方法
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Application No.: US12397555Application Date: 2009-03-04
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Publication No.: US08138000B2Publication Date: 2012-03-20
- Inventor: Bernd Keller , James Ibbetson , Peter Andrews , Gerald H. Negley , Norbert Hiller
- Applicant: Bernd Keller , James Ibbetson , Peter Andrews , Gerald H. Negley , Norbert Hiller
- Applicant Address: US NC Durham
- Assignee: Cree, Inc.
- Current Assignee: Cree, Inc.
- Current Assignee Address: US NC Durham
- Agency: Myers Bigel Sibley & Sajovec
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A submount for a semiconductor light emitting device includes a semiconductor substrate having a cavity therein configured to receive the light emitting device. A first bond pad is positioned in the cavity to couple to a first node of a light emitting device received in the cavity. A second bond pad is positioned in the cavity to couple to a second node of a light emitting device positioned therein. Light emitting devices including a solid wavelength conversion member and methods for forming the same are also provided.
Public/Granted literature
- US20090159918A1 SEMICONDUCTOR LIGHT EMITTING DEVICES AND SUBMOUNTS AND METHODS FOR FORMING THE SAME Public/Granted day:2009-06-25
Information query
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