发明授权
US08138024B2 Package system for shielding semiconductor dies from electromagnetic interference
有权
用于屏蔽半导体芯片的封装系统免受电磁干扰
- 专利标题: Package system for shielding semiconductor dies from electromagnetic interference
- 专利标题(中): 用于屏蔽半导体芯片的封装系统免受电磁干扰
-
申请号: US12037774申请日: 2008-02-26
-
公开(公告)号: US08138024B2公开(公告)日: 2012-03-20
- 发明人: Byung Tai Do , Rui Huang , Seng Guan Chow , Heap Hoe Kuan
- 申请人: Byung Tai Do , Rui Huang , Seng Guan Chow , Heap Hoe Kuan
- 申请人地址: SG Singapore
- 专利权人: STATS ChipPAC Ltd.
- 当前专利权人: STATS ChipPAC Ltd.
- 当前专利权人地址: SG Singapore
- 代理商 Mikio Ishimaru
- 主分类号: H01L21/56
- IPC分类号: H01L21/56 ; H01L23/552
摘要:
A method of manufacturing a package system includes: providing a semiconductor die with a contact pad and a ground pad, mounting the semiconductor die on a package substrate using and adhesive layer, forming a vertical conductive structure on top of the ground pad in the semiconductor die, encapsulating at least portions of the semiconductor die, the vertical conductive structure, and the package substrate using an encapsulant, covering at least portions of the encapsulant and the vertical conductive structure with a shielding layer to place the vertical conductive structure in electrical contact with the shielding layer, and connecting the shielding layer to the package substrate.