发明授权
- 专利标题: Super junction semiconductor device
- 专利标题(中): 超结半导体器件
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申请号: US12419308申请日: 2009-04-07
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公开(公告)号: US08138047B2公开(公告)日: 2012-03-20
- 发明人: Ming-Jang Lin
- 申请人: Ming-Jang Lin
- 申请人地址: TW Hsinchu County
- 专利权人: inergy Technology Inc.
- 当前专利权人: inergy Technology Inc.
- 当前专利权人地址: TW Hsinchu County
- 代理机构: CKC & Partners Co., Ltd.
- 主分类号: H01L21/336
- IPC分类号: H01L21/336 ; H01L29/78
摘要:
In the specification and drawing a super junction semiconductor device is disclosed. The super junction semiconductor device comprises a P-type layer, a N+ substrate, a N-type layer, a silicon dioxide layer and a P+ layer. The N+ substrate is disposed under the P-type layer. The N-type layer is disposed on the N+ substrate. The silicon dioxide layer is disposed between the N-type layer and the P-type layer. The P+ layer is disposed on the P-type layer and the N-type layer.
公开/授权文献
- US20090250727A1 SUPER JUNCTION SEMICONDUCTOR DEVICE 公开/授权日:2009-10-08
信息查询
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