发明授权
US08138239B2 Polymer thermal interface materials 有权
聚合物热界面材料

  • 专利标题: Polymer thermal interface materials
  • 专利标题(中): 聚合物热界面材料
  • 申请号: US12342322
    申请日: 2008-12-23
  • 公开(公告)号: US08138239B2
    公开(公告)日: 2012-03-20
  • 发明人: Ed PrackYi LiWei Wu
  • 申请人: Ed PrackYi LiWei Wu
  • 申请人地址: US CA Santa Clara
  • 专利权人: Intel Corporation
  • 当前专利权人: Intel Corporation
  • 当前专利权人地址: US CA Santa Clara
  • 代理商 David L. Guglielmi
  • 主分类号: C08K7/16
  • IPC分类号: C08K7/16
Polymer thermal interface materials
摘要:
In some embodiments, polymer thermal interface materials are presented. In this regard, a thermal interface material is introduced comprising a polymer matrix, a matrix additive, wherein the matrix additive comprises a fluxing agent, and a spherical filler material, wherein the spherical filler material comprises a metallic core with an organic solderability preservative coating. Other embodiments are also disclosed and claimed.
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