发明授权
- 专利标题: Polymer thermal interface materials
- 专利标题(中): 聚合物热界面材料
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申请号: US12342322申请日: 2008-12-23
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公开(公告)号: US08138239B2公开(公告)日: 2012-03-20
- 发明人: Ed Prack , Yi Li , Wei Wu
- 申请人: Ed Prack , Yi Li , Wei Wu
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理商 David L. Guglielmi
- 主分类号: C08K7/16
- IPC分类号: C08K7/16
摘要:
In some embodiments, polymer thermal interface materials are presented. In this regard, a thermal interface material is introduced comprising a polymer matrix, a matrix additive, wherein the matrix additive comprises a fluxing agent, and a spherical filler material, wherein the spherical filler material comprises a metallic core with an organic solderability preservative coating. Other embodiments are also disclosed and claimed.
公开/授权文献
- US20100159233A1 POLYMER THERMAL INTERFACE MATERIALS 公开/授权日:2010-06-24
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