- 专利标题： Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
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申请号： US11629068申请日： 2005-06-08
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公开(公告)号： US08138268B2公开(公告)日： 2012-03-20
- 发明人: Shigeki Katogi , Houko Sutou , Hiroyuki Izawa , Toshiaki Shirasaka , Masami Yusa , Takanobu Kobayashi
- 申请人： Shigeki Katogi , Houko Sutou , Hiroyuki Izawa , Toshiaki Shirasaka , Masami Yusa , Takanobu Kobayashi
- 申请人地址： JP Tokyo
- 专利权人： Hitachi Chemical Company, Ltd.
- 当前专利权人： Hitachi Chemical Company, Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Antonelli, Terry, Stout & Kraus, LLP.
- 优先权： JPP2004-171721 20040609; JPP2004-234374 20040811
- 国际申请： PCT/JP2005/010497 WO 20050608
- 国际公布： WO2005/121266 WO 20051222
- 主分类号： C08F8/00
- IPC分类号： C08F8/00
摘要：
The adhesive composition of the invention comprises a thermoplastic resin, a radical polymerizing compound, a radical polymerization initiator and a radical polymerization regulator. According to the present invention it is possible to provide an adhesive composition, a circuit connecting material, a connection structure for a circuit member and a semiconductor device whereby curing treatment can be carried out with sufficient speed at low temperature, curing treatment can be carried out with a wide process margin, and adequately stable adhesive strength can be obtained.
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