The present invention relates to a light emitting diode (LED) package. An object of the present invention is to provide an LED package having a metal PCB, which has a superior heat dissipation property and a compact structure, does not largely restrict use of conventional equipments, and is compatible with an electronic device or illumination device currently used widely. To this end, an LED package according to the present invention comprises a metal printed circuit board (PCB) formed by laminating first and second sheet metal plates with an electric insulating layer interposed therebetween; and an LED chip mounted on the first sheet metal plate of the metal PCB, wherein the first sheet metal plate has electrode patterns and leads respectively extending from the electrode patterns.