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US08138596B2 Method for manufacturing an element having electrically conductive members for application in a microelectronic package 有权
用于制造具有用于微电子封装中的导电构件的元件的方法

  • 专利标题： Method for manufacturing an element having electrically conductive members for application in a microelectronic package
  • 专利标题（中）： 用于制造具有用于微电子封装中的导电构件的元件的方法
  • 申请号： US12594600
    申请日： 2008-04-11
  • 公开(公告)号： US08138596B2
    公开(公告)日： 2012-03-20
  • 发明人: Johannes W. Weekamp
  • 申请人： Johannes W. Weekamp
  • 申请人地址： NL Eindhoven
  • 专利权人： NXP B.V.
  • 当前专利权人： NXP B.V.
  • 当前专利权人地址： NL Eindhoven
  • 优先权： EP07106330 20070417
  • 国际申请： PCT/IB2008/051391 WO 20080411
  • 国际公布： WO2008/126043 WO 20081023
  • 主分类号： H01L23/48
  • IPC分类号： H01L23/48
Method for manufacturing an element having electrically conductive members for application in a microelectronic package
摘要：
A microelectronic package (31) has a microelectronic device, which is encapsulated in a quantity of material (27), and a lead frame element (15) for enabling the microelectronic device to be electrically contacted from outside of the package (31). The lead frame element (15) comprises at least two elongated members (11) comprising electrically conductive material and a filling material (12) comprising electrically insulating material, wherein the members (11) are partially embedded in the filling material (12). The lead frame element (15) is manufactured by providing elongated members (11), positioning the members (11) according to a predetermined configuration, providing filling material (12) to spaces (13) which are present between the members (11), and possibly removing portions of the filling material (12) and the members (11) in order to expose the electrically conductive material of the members (11). An important advantage of manufacturing the lead frame element (15) on the basis of elongated members (11) and a filling material (12) is that no waste or only a small quantity of waste is produced.
摘要（中）：

微电子封装（31）具有被封装在一定数量的材料（27）中的微电子器件，以及用于使微电子器件能够从封装（31）的外部电接触的引线框架元件（15）。 引线框架元件（15）包括至少两个包括导电材料的细长构件（11）和包括电绝缘材料的填充材料（12），其中构件（11）部分地嵌入填充材料（12）中。 通过提供细长构件（11）来制造引线框架元件（15），根据预定构造来定位构件（11），向构件（11）之间存在的间隙（13）提供填充材料（12） 并且可能去除填充材料（12）和构件（11）的部分，以暴露构件（11）的导电材料。 基于细长构件（11）和填充材料（12）制造引线框架元件（15）的重要优点是不产生浪费或仅产生少量的废物。

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