发明授权
- 专利标题： Separation apparatus and separation method
- 专利标题（中）： 分离装置和分离方法
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申请号： US12420825申请日： 2009-04-09
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公开(公告)号： US08141611B2公开(公告)日： 2012-03-27
- 发明人: Yao-Hsiang Lai , Ta-Cheng Liu , Jung-Hung Hung , Yu-Meng Lin , Kuo-Lung Yang
- 申请人： Yao-Hsiang Lai , Ta-Cheng Liu , Jung-Hung Hung , Yu-Meng Lin , Kuo-Lung Yang
- 申请人地址： TW Taoyuan County
- 专利权人： HTC Corporation
- 当前专利权人： HTC Corporation
- 当前专利权人地址： TW Taoyuan County
- 代理机构： Jianq Chyun IP Office
- 优先权： TW97142574A 20081104
- 主分类号： B32B38/10
- IPC分类号： B32B38/10
摘要：
A separation apparatus for separating two planar devices bonded together by an adhesive layer is provided. The separation apparatus includes a base, a sliding module, a cutting member, and a positioning stage. The sliding module is mounted on the base. The cutting member is connected to the sliding module and is moveable in a two-dimensional plane with respect to the base by the sliding module for cutting the adhesive layer. The positioning stage is mounted on the base for positioning the planar devices and the adhesive layer therebetween on the base.
公开/授权文献
- US20100107834A1 SEPARATION APPARATUS AND SEPARATION METHOD 公开/授权日：2010-05-06